品牌:t-Global Technology
封装:Assorted (BGA, LGA, CPU, ASIC...)
分类:散热器
描述:XL25 CERAMIC BOARD 40X40X2MM
价格:¥0.000
库存:2,897
数据表
描述:XL25 CERAMIC BOARD 10X10X2MM
库存:2,309
描述:XL25 CERAMIC BOARD 30X30X2MM
库存:2,854
品牌:Ohmite
封装:TO-126
描述:HEATSINK FOR TO-126 25MM
库存:3,343
描述:HEATSINK FOR TO-126 40MM
库存:2,154
库存:2,740
库存:3,239
品牌:Molex
封装:-
描述:CHIPSET COOLER CU #1 6500 RPM
库存:3,976
描述:CHIPSET COOLER #2 COPPER 6500RPM
库存:2,163
品牌:Assmann WSW Components
封装:TO-220
描述:HEATSINK ALUM ANOD
库存:2,885
库存:3,937
描述:XL25 CERAMIC 20X20MM W/LI98C ADH
库存:3,028
描述:XL25 CERAMIC 30X30MM W/LI98C ADH
库存:3,330
描述:XL25 CERAMIC 10X10MM W/LI98C ADH
库存:3,568
库存:3,849
库存:2,542
封装:TO-263 (D²Pak)
描述:TO-263 SMD HEAT SINK ANODZD
库存:3,164
封装:TO-268 (D³Pak)
描述:TO-268 SMD HEAT SINK ANODZD
库存:2,193
描述:TO-263 SMD HEAT SINK
库存:3,475
描述:TO-268 SMD HEAT SINK
库存:2,792
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