品牌:Advanced Thermal Solutions Inc.
封装:Assorted (BGA, LGA, CPU, ASIC...)
分类:散热器
描述:HEATSINK 57.9X60.96X22.86MM
价格:¥91.800
库存:2,129
数据表
封装:BGA
描述:HEAT SINK 33MM X 33MM X 9.5MM
价格:¥93.432
库存:2,925
描述:HEATSINK 57.9X60.96X17.78MM T412
价格:¥93.976
库存:3,295
描述:HEAT SINK 42.5 X 42.5 X 14.5MM
价格:¥94.316
库存:3,338
描述:HEAT SINK 37.5 X 37.5 X 9.5MM
价格:¥94.588
库存:2,090
品牌:iBASE Technology
封装:IBR117
描述:HEATSINK;HSIBR117-B V-A
价格:¥96.152
库存:2,219
封装:IBR210
描述:HEATSINK;HSIBR210-B V-A
库存:2,038
描述:HEAT SINK 23MM X 23MM X 24.5MM
价格:¥74.324
库存:2,408
描述:HEATSINK 57.9X60.96X22.86MM T412
价格:¥96.424
库存:2,566
描述:HEAT SINK 27MM X 27MM X 14.5MM
价格:¥96.560
库存:2,190
描述:MAXIGRIP FANSINK 40X40X24.5MM
价格:¥99.892
库存:3,235
封装:ASIC
描述:HEAT SINK 40MM X 30MM X 5MM
价格:¥103.972
库存:2,593
描述:HEAT SINK 31MM X 31MM X 19.5MM
价格:¥108.528
库存:2,629
封装:ET970
描述:HEAT SPREADER FOR ET970 (H051HSE
价格:¥114.512
库存:3,530
封装:ET975
描述:HEAT SPREADER FOR ET975 (H051HSE
库存:3,537
封装:ET860
描述:HEATSINK FOR ET860(H051HSET860B0
库存:3,093
品牌:Brainboxes
封装:Raspberry Pi
描述:RASPBERRY PI COMPUTE MODULE
库存:2,085
描述:HEATSINK 57.9X60.96X11.43MM T766
价格:¥116.076
库存:100
描述:HEATSINK 40X38X15MM NYLONPUSHPIN
价格:¥116.348
库存:3,275
描述:MAXIGRIP FANSINK 29X29X19.5MM
价格:¥118.728
库存:2,557
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