品牌:Analog Devices Inc./Maxim Integrated
封装:-
分类:专业集成电路
描述:IC BATT PACK MEMORY TDFN
价格:¥0.000
库存:2,311
封装:6-SMD, J-Lead
描述:IC EEPROM MEMORY SMD TSOC
库存:2,422
品牌:Renesas Electronics America Inc
封装:784-BBGA, FCBGA
描述:FCBGA 29.00X29.00X2.75 MM, 1.00M
库存:3,177
数据表
库存:2,620
封装:1024-BBGA, FCBGA
描述:FCBGA 33.00X33.00X2.80 MM, 1.00M
库存:3,570
品牌:Microchip Technology
封装:12-DIP Module, 9 Leads
描述:CHIP SCALE ATOMIC CLOCK
库存:3,989
库存:3,236
库存:2,212
封装:8-SOIC (0.154, 3.90mm Width)
描述:TRUST FLEX LORAWAN I2C PROVISION
库存:3,351
封装:8-UFDFN Exposed Pad
描述:TRUST CUSTOM LORAWAN I2C PROVISI
库存:2,118
库存:2,540
库存:2,343
库存:2,095
库存:3,447
库存:2,951
库存:2,415
库存:3,219
库存:2,850
库存:2,594
库存:2,418
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