品牌:Microsemi Corporation
封装:-
分类:射频前端(LNA+PA)
描述:WIRELESS LAN FRONT-END MODULE
价格:¥0.000
库存:2,593
库存:2,901
库存:2,724
库存:2,916
品牌:Microchip Technology
封装:16-XFQFN Exposed Pad
库存:2,410
库存:3,301
库存:3,274
库存:2,468
库存:2,516
库存:3,177
品牌:Broadcom Limited
描述:IC FRONT END
库存:2,336
库存:2,150
库存:3,740
库存:2,253
库存:2,042
描述:MODULE PA
库存:3,452
品牌:Skyworks Solutions Inc.
描述:IC FRONT END MOD 5GHZ WLAN 16QFN
库存:3,134
数据表
库存:3,312
封装:16-UFQFN Exposed Pad
库存:3,160
库存:3,863
首页
产品
电话
我的