接口-传感器和检测器接口 - 欧可尔电子(深圳)有限公司

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Manufacturer	Package/Case	Packaging	Series	ProductStatus	Type	InputType	OutputType	Current-Supply	OperatingTemperature	MountingType
ABLIC Inc. Allegro MicroSystems ams Analog Devices Inc. Analog Devices Inc./Maxim Integrated Aptina-ON Semiconductor Asahi Kasei Microdevices/AKM Atmel Azoteq (Pty) Ltd Broadcom Limited Burr Brown Cirrus Logic Inc. Diodes Incorporated Fairchild Semiconductor Freescale Semiconductor Grayhill Inc. Harris Corporation IDT, Integrated Device Technology Inc Infineon Technologies Interlink Electronics Intersil LSI/CSI Lumissil Microsystems MaxLinear, Inc. Melexis Technologies NV Microchip Technology Motorola National Semiconductor NXP USA Inc. onsemi Renesas Electronics America Inc Rohm Semiconductor ScioSense Semtech Corporation STMicroelectronics Texas Instruments Triad Semiconductor, Inc. Xicor-Division of Intersil	- 10-PowerTFSOP, 10-MSOP (0.118, 3.00mm Width) 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) 10-VFDFN Exposed Pad 10-WFDFN Exposed Pad 100-LFBGA, CSPBGA 100-TQFP 105-LFBGA, CSPBGA 112-LFBGA, CSPBGA 12-LFLGA 12-WFBGA, WLBGA 12-WFDFN Exposed Pad 12-WFQFN Exposed Pad 120-TFBGA 128-LFBGA, CSPBGA 14-CDIP (0.300, 7.62mm) 14-DIP (0.300, 7.62mm) 14-LSSOP (0.173, 4.40mm Width) 14-SOIC (0.154, 3.90mm Width) 14-SOIC (0.295, 7.50mm Width) 14-SSOP (0.209, 5.30mm Width) 14-TSSOP (0.173, 4.40mm Width) 14-VFQFN Exposed Pad 16-CDIP (0.300, 7.62mm) 16-DIP (0.300, 7.62mm) 16-LSOP (0.173, 4.40mm Width) 16-LSSOP (0.173, 4.40mm Width) 16-SOIC (0.154, 3.90mm Width) 16-SOIC (0.173, 4.40mm Width) 16-SOIC (0.295, 7.50mm Width) 16-SSOP (0.154, 3.90mm Width) 16-SSOP (0.209, 5.30mm Width) 16-TSSOP (0.173, 4.40mm Width) 16-UFBGA, WLCSP 16-UFQFN Exposed Pad 16-VFQFN Exposed Pad 16-VQFN Exposed Pad 16-VQFN Exposed Pad, CSP 16-WFBGA, WLBGA 16-WFQFN Exposed Pad 16-WQFN Exposed Pad 16-XFQFN Exposed Pad 17-UFBGA, WLCSP 18-DIP (0.300, 7.62mm) 18-UFBGA, WLCSP 196-LFBGA, CSPBGA 20-CDIP (0.300, 7.62mm) 20-CLCC 20-LCC (J-Lead) 20-PowerTSSOP (0.173, 4.40mm Width) 20-SOIC (0.295, 7.50mm Width) 20-SOIC (0.295, 7.50mm Width) Exposed Pad 20-SSOP (0.209, 5.30mm Width) 20-TSSOP (0.173, 4.40mm Width) 20-UFQFN Exposed Pad 20-VFQFN Exposed Pad 20-VQFN Exposed Pad 20-WFQFN Exposed Pad 20-WFQFN Exposed Pad, CSP 24-CDIP (0.600, 15.24mm) 24-SOIC (0.295, 7.50mm Width) 24-SSOP (0.154, 3.90mm Width) 24-SSOP (0.209, 5.30mm Width) 24-UFBGA, WLCSP 24-VFQFN Exposed Pad 24-WFQFN Exposed Pad 25-TFBGA 28-DIP (0.500, 12.70mm), 22 Leads 28-LCC (J-Lead) 28-LSSOP (0.220, 5.60mm Width) 28-SOIC (0.295, 7.50mm Width) 28-SSOP (0.209, 5.30mm Width) 28-TSSOP (0.173, 4.40mm Width) 28-TSSOP (0.173, 4.40mm Width) Exposed Pad 28-UFQFN Exposed Pad 28-VFQFN Exposed Pad 28-VQFN Exposed Pad 28-WFQFN Exposed Pad 28-WFQFN Exposed Pad, CSP 32-SOP (0.213, 5.40mm Width) 32-TQFP Exposed Pad 32-VFQFN Exposed Pad 32-VFQFN Exposed Pad, 32-MLF® 32-WFQFN Exposed Pad 32-WFQFN Exposed Pad, CSP 33-UFBGA, WLCSP 35-UFBGA, WLCSP 36-UFBGA, DSBGA 36-VFQFN Exposed Pad 36-WFBGA, WLBGA 38-DIP (0.500, 12.70mm), 8 Leads 38-DIP (0.800, 20.32mm), 12 Leads 38-DIP (0.800, 20.32mm), 15 Leads 38-TFSOP (0.173, 4.40mm Width) Exposed Pad 38-VFLGA Module 40-VFQFN Exposed Pad 40-VFQFN Exposed Pad, CSP 40-WFQFN Exposed Pad 44-BSSOP (0.433, 11.00mm Width) Exposed Pad 44-LCC (J-Lead) 44-LQFP 44-VFQFN Exposed Pad 48-LQFP 48-PowerTQFP 48-TQFP 48-TQFP Exposed Pad 48-VFQFN Exposed Pad 48-VFQFN Exposed Pad, CSP 48-WFQFN Exposed Pad, CSP 49-VFBGA 54-BSSOP (0.295, 7.50mm Width) Exposed Pad 54-SSOP (0.295, 7.50mm Width) Exposed Pad 56-VFQFN Exposed Pad, CSP 56-WFQFN Exposed Pad 6-WDFN Exposed Pad 64-LFBGA, CSPBGA 64-LQFP 64-PowerTQFP 64-QFP 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad, CSP 68-VFQFN Exposed Pad 70-LFBGA 8-CDIP (0.300, 7.62mm) 8-DIP (0.300, 7.62mm) 8-FlipChip 8-SOIC (0.154, 3.90mm Width) 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) 8-UFDFN Exposed Pad 8-VDFN Exposed Pad 8-VFDFN Exposed Pad 84-LFBGA, CSPBGA 84-TFBGA 84-VFQFN Dual Rows, Exposed Pad 9-UFBGA, WLCSP 9-XFBGA, WLCSP 96-LFBGA, CSPBGA Die Module SC-74A, SOT-753 SOT-23-6 Thin, TSOT-23-6 Surface Mount TO-205AA, TO-5-8 Metal Can	- Bag Box Bulk Bulk,- Bulk,Tray Bulk,Tube Cut Tape (CT) Cut Tape (CT),Digi-Reel® Cut Tape (CT),Digi-Reel®,Bulk Strip Tape & Reel (TR) Tape & Reel (TR),Bulk Tape & Reel (TR),Cut Tape (CT) Tape & Reel (TR),Cut Tape (CT),Digi-Reel® Tape & Reel (TR),Cut Tape (CT),Digi-Reel®,Bulk Tray Tray,Tray Tube Tube,Tube	* - 65 AD9840 AD9847 AD9929 AD9995 Automotive, AEC-Q100 cLite™ IQ Switch® ProxFusion® IQ Switch®, ProxFusion™ IQ Switch®, ProxSense® LT® MicroJoystick PICOSTRAIN® QTwo™ TPS ZoomingADC™	Active Discontinued at Mosen Last Time Buy Not For New Designs Obsolete	- ADC, DAC Automotive Battery Management Biometric Sensor Hub Capacitance-to-Digital Converter Capacitive Sensor Capacitive Sensor Controller Capacitive Switch Capacitive Switch Controller Capacitive Touch and Proximity Sensor Capacitive Touch Screen Controller CCD Signal Processor, 10-Bit CCD Signal Processor, 12-Bit CCD Signal Processor, 14-Bit Clock Generator Controller Converter Current Loop Protector Current Transmitter Data Acquisition Data Acquisition System (DAS) Detector Controller Distance Measuring, Preamplifier Distributed Systems Interface Engine Knock Signal Processor Front End Hall Effect Sensor Horn Driver Hub Image Sensor Infrared (IR) Interface Level Shifter Light to Digital Converter Motion Coprocessor Optical Output Driver Piezoelectric - Strain Gauge Power Management Preamplifier Pressure Sensor Programmable Amplifier/Attenuator Proximity Detector R/D Converter Relay/Load Driver Resistive Sensor Conditioner Sensor Interface Sensor Interface - Unprogrammed Sensor Interface, Signal Conditioner Serializer SFP Laser Controller SFP+ Controller Signal Conditioner Signal Processor Smart Sensor Smoke Detector Temperature Sensor Thermocouple Amplifier Thermocouple Conditioner Thermocouple to Digital Converter Time to Flight to Digital Converter Touch Sensor Translator USB Joystick Controller Variable Reluctance	- 4 ~ 20mA Analog Analog Current Analog Voltage Analog, Digital Analog, Logic, Photodiode Capacitive Capacitive, Inductive CML CMOS Differential Digital Ionization Logic LVDS Parallel Photodiode Photoelectric Serial Thermocouple Thermocouple (J) Thermocouple (K) Thermocouple (Multiple) Ultrasound Voltage	- 1-Wire®, I²C, SPI 2-Wire 3-Wire Serial 4 ~ 20mA 4mA ~ 20mA Analog Analog Voltage Analog, Digital CML CMOS Current Differential Digital Digital, Serial ISO9141 I²C I²C, Serial I²C, SPI LIN Logic LVDS Parallel Serial Serial, SPI SPI Thermocouple Voltage	- 1 mA 1 µA 1.1 mA 1.2 mA 1.3 mA 1.35 mA 1.4 mA 1.5 mA 1.5 µA 1.6 mA 1.9 µA 10 mA 10 nA 10 µA 100 nA 100 µA 12 mA 12 µA 12.5 mA 120 µA 125 mA 13 mA 13.5 mA 13.6 mA 13.6 µA 14 µA 145 mA 15 mA 150 nA 150 µA 160 µA 165 mA 170 µA 173 µA 18 mA 180 µA 184 µA 2 mA 2 µA 2.1 mA 2.3 mA 2.5 mA 2.5 µA 2.6 mA 2.7 mA 2.8 mA 2.85 mA 2.9 mA 20 mA 200 µA 225 µA 23 mA 24 mA 25 mA 25 µA 250 mA 250 µA 27 mA 29 µA 3.5 mA 3.5 µA 3.8 µA 30 mA 30 µA 300 µA 350 µA 360 µA 4 mA 4 µA 4.2 µA 4.5 mA 4.9 mA 40 mA 40 µA 41 mA 457 µA 476 µA 48 mA 495 mA 5 mA 5.3 µA 5.5 mA 50 µA 500 µA 55 mA 550 µA 6 mA 6 µA 6.5 mA 6.5 µA 6.8 mA 600 µA 62 µA 7 mA 7.1 mA 7.5 mA 70 µA 720 µA 73 mA 75 mA 8 mA 8 µA 8.5 mA 80 mA 80 µA 800 µA 840 µA 86 mA 890 µA 9 mA 9 µA 9.3 mA 90 µA 900 µA 95 mA 950 µA	- -10°C ~ 60°C -10°C ~ 60°C (TA) -20°C ~ 105°C (TA) -20°C ~ 45°C -20°C ~ 70°C -20°C ~ 75°C -20°C ~ 85°C -25°C ~ 105°C (TA) -25°C ~ 70°C (TA) -25°C ~ 75°C -25°C ~ 85°C -30°C ~ 75°C -40°C ~ 100°C -40°C ~ 105°C -40°C ~ 105°C (TA) -40°C ~ 110°C -40°C ~ 115°C -40°C ~ 120°C -40°C ~ 125°C -40°C ~ 125°C (TA) -40°C ~ 140°C -40°C ~ 150°C -40°C ~ 150°C (TA) -40°C ~ 70°C (TA) -40°C ~ 85°C -40°C ~ 85°C (TA) -40°C ~ 90°C (TA) -40°C ~ 95°C -45°C ~ 125°C -55°C ~ 125°C -55°C ~ 150°C 0°C ~ 50°C 0°C ~ 60°C (TA) 0°C ~ 70°C 0°C ~ 70°C (TA) 0°C ~ 85°C 0°C ~ 85°C (TA) 0°C ~ 90°C 150°C 20°C ~ 85°C 25°C ~ 100°C	- Panel Mount Surface Mount Surface Mount, Wettable Flank Through Hole

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Results:

: MC33794DWBR2

品牌:NXP USA Inc.

封装:54-BSSOP (0.295, 7.50mm Width) Exposed Pad

分类:接口-传感器和检测器接口

描述:IC SENSOR ELECTRIC FIELD 54-SOIC

价格:￥0.000

库存:3,742

立即询盘

数据表

: MCZ145012EGR2

品牌:NXP USA Inc.

封装:16-SOIC (0.295, 7.50mm Width)

分类:接口-传感器和检测器接口

描述:IC SMOKE DETECT PHOTOELEC 16SOIC

价格:￥0.000

库存:3,760

立即询盘

数据表

: MCZ145010EGR2

品牌:NXP USA Inc.

封装:16-SOIC (0.295, 7.50mm Width)

分类:接口-传感器和检测器接口

描述:IC SMOKE DETECT PHOTOELEC 16SOIC

价格:￥0.000

库存:3,574

立即询盘

数据表

: MCZ145010EG

品牌:NXP USA Inc.

封装:16-SOIC (0.295, 7.50mm Width)

分类:接口-传感器和检测器接口

描述:IC SMOKE DETECT PHOTOELEC 16SOIC

价格:￥0.000

库存:2,589

立即询盘

数据表

: MCZ145012EG

品牌:NXP USA Inc.

封装:16-SOIC (0.295, 7.50mm Width)

分类:接口-传感器和检测器接口

描述:IC SMOKE DETECT PHOTOELEC 16SOIC

价格:￥0.000

库存:2,225

立即询盘

数据表

: MCZ33793EF

品牌:NXP USA Inc.

封装:16-SOIC (0.154, 3.90mm Width)

分类:接口-传感器和检测器接口

描述:IC DSI SLAVE REMOTE SENS 16-SOIC

价格:￥0.000

库存:3,356

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数据表

: MC33790HEG

品牌:NXP USA Inc.

封装:16-SOIC (0.295, 7.50mm Width)

分类:接口-传感器和检测器接口

描述:IC DSI INTERFACE 2CH 16SOIC

价格:￥0.000

库存:2,104

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数据表

: MC33790HEGR2

品牌:NXP USA Inc.

封装:16-SOIC (0.295, 7.50mm Width)

分类:接口-传感器和检测器接口

描述:IC DSI INTERFACE 2CH 16SOIC

价格:￥0.000

库存:2,455

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数据表

: U2720-XS1421C

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:3,962

立即询盘

: U2720-XS1421CB

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:WAFER (UNSAWN) - BOX

价格:￥0.000

库存:2,443

立即询盘

: ZOPT1200AC4C

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:2,329

立即询盘

: ZOPT1200AC4CT

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:2,315

立即询盘

: ZSC31010CEC

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:2,591

立即询盘

数据表

: ZSC31010CIC

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:2,009

立即询盘

数据表

: ZSC31014EAC

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:2,274

立即询盘

数据表

: ZSC31014EIC

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:3,340

立即询盘

数据表

: ZSC31015EAC

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:3,880

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数据表

: ZSC31015EEC

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:3,381

立即询盘

数据表

: ZSC31015EIC

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:3,264

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数据表

: ZSC31050FAC

品牌:IDT, Integrated Device Technology Inc

封装:-

分类:接口-传感器和检测器接口

描述:DICE (WAFER SAWN) - FRAME

价格:￥0.000

库存:2,176

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数据表

Total 1369 Records«Prev 1... 60 61 62 636465 66 67...69 Next»

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