接口-调制解调器-集成电路和模块 - 欧可尔电子(深圳)有限公司

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Manufacturer	Package/Case	Packaging	Series	ProductStatus	DataFormat	BaudRates	Voltage-Supply	MountingType
Advanced Micro Devices Analog Devices Inc. Analog Devices Inc./Maxim Integrated CML Microcircuits Conexant Copeland Communications Inc. Cypress Semiconductor Corp Freescale Semiconductor Harris Corporation Infineon Technologies Intel IXYS Integrated Circuits Division Lantiq Microchip Technology NXP USA Inc. onsemi Rochester Electronics, LLC Semtech Corporation Silicon Labs Skyworks Solutions Inc. SMSC STMicroelectronics Texas Instruments Wintec Industries Zarlink Zilog	- 100-TQFP 120-LQFP 128-BFQFP 128-LQFP 128-QFP 16-DIP (0.300, 7.62mm) 16-SOIC (0.154, 3.90mm Width) 16-SOIC (0.295, 7.50mm Width) 16-TSSOP (0.173, 4.40mm Width) 20-SOIC (0.295, 7.50mm Width) 20-TSSOP (0.173, 4.40mm Width) 208-QFP 22-DIP (0.400, 10.16mm) 24-SOIC (0.295, 7.50mm Width) 24-SSOP (0.209, 5.30mm Width) 24-TSSOP (0.173, 4.40mm Width) 24-VFQFN Exposed Pad 24-WFQFN Exposed Pad, CSP 28-DIP (0.600, 15.24mm) 28-LCC (J-Lead) 28-SOIC (0.295, 7.50mm Width) 28-SSOP (0.209, 5.30mm Width) 28-VFCLGA 32-LCC (J-Lead) 32-LQFP 32-TQFP 32-VFQFN Exposed Pad 38-VFQFN Exposed Pad 40-DIP Module 44-LCC (J-Lead) 44-LQFP 48-LQFP 48-VFQFN Exposed Pad 52-VFQFN Exposed Pad 56-VFQFN Exposed Pad 64-LQFP 64-VFQFN Exposed Pad 8-SOIC (0.154, 3.90mm Width) Exposed Pad Module Surface Mount	Box Bulk Bulk,Tray Bulk,Tube Bulk,Tube,Tube Tape & Reel (TR) Tape & Reel (TR),Bulk Tape & Reel (TR),Cut Tape (CT),Digi-Reel® Tape & Reel (TR),Cut Tape (CT),Digi-Reel®,Bulk Tray Tray,Tray Tube Tube,Tube	* - AD1801 CY8CPLC10 ISOcap™ ISOmodem® ISOmodem™ SL SLM	Active Discontinued at Mosen Last Time Buy Not For New Designs Obsolete	- ASK ASK over Home Power Lines FSK FSK, Bell 202 FSK, V.21, V.22, V.23, Bell 103, Bell 212A FSK, V.23 HART V.21, V.22, V.22B, V.23, V.32, V.32B, V.34, V.90, Bell 103, Bell 212 V.21, V.22, V.23, Bell 103, Bell 202, FSK V.21, V.22, V.23, Bell 103, Bell 212A V.21, V.22, V.23, V.29, Bell 103, Bell 212A V.21, V.22, V.23, V.29, V.32, Bell 103, Bell 212A V.21, V.22, V.23, V.29, V.32, V.34, Bell 103, Bell 212A V.21, V.22, V.23, V.29, V.32, V.34, V.90, V.92, Bell 103, Bell 212A V.21, V.22, V.23, V.32, Bell 103, Bell 202, FSK V.21, V.22, V.23, V.32, V.34, V.90, Bell 103, Bell 212A V.21, V.23, Bell 103, Bell 108, Bell 113, Bell 202 V.21, V.23, Bell 103, Bell 202, FSK V.22 V.22, V.23 V.22, V23, V.32, V.34, V.90, Bell 103, Bell 212A V.22, V23, V.32, V.34, V.90, V.92, Bell 103, Bell 212A V.32 V.32, V.34 V.32, V.34, V.90 V.32, V.34, V.90, V.92 V.34 V.34, V.92 V.90 V.92	- 1.2k 1.2k, 1.8k 1.8k 14.4k 19.2k 2.4k 200k 20k 300 ~ 9.6k 33.6k 38.4k 4.8k 56k 9.6k Selectable	- 1.42V ~ 1.65V 1.71V ~ 5.5V 1.7V ~ 1.9V, 3V ~ 3.6V 1.8V ~ 3.5V 12V 2.7V ~ 3.6V 2.7V ~ 5.5V 3.3V 3.3V ~ 5V 3.3V, 5V 3V ~ 12V 3V ~ 3.6V 3V ~ 3.6V, 4.75V ~ 5.25V 3V ~ 5.25V 3V ~ 5.5V 3V ~ 5V 4.5V ~ 5.5V 4.75V ~ 5.25V 5V	- Socket Surface Mount Through Hole

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: CD22212E1

品牌:Harris Corporation

封装:22-DIP (0.400, 10.16mm)

分类:接口-调制解调器-集成电路和模块

描述:SINGLE-CHIP 1200BPS MODEM

价格:￥52.428

库存:770

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数据表

: CD22212E

品牌:Harris Corporation

封装:28-DIP (0.600, 15.24mm)

分类:接口-调制解调器-集成电路和模块

描述:SINGLE-CHIP 1200BPS MODEM

价格:￥52.428

库存:440

立即询盘

数据表

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